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LM2991SX Datasheet(PDF) 2 Page - Texas Instruments |
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LM2991SX Datasheet(HTML) 2 Page - Texas Instruments |
2 / 19 page LM2991 SNVS099H – MAY 1999 – REVISED JUNE 2013 www.ti.com Connection Diagrams Front View Top View Figure 1. TO-220 Package, 5-Lead Figure 2. DDPAK, TO-263 Package, 5-Lead, Surface-Mount See Package Number KC and NDH See Package Number KTT These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Input Voltage −26V to +0.3V ESD Susceptibility(3) 2 kV Power Dissipation(4) Internally limited Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec.) 230°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Human body model, 100 pF discharged through a 1.5 k Ω resistor. (4) The maximum allowable power dissipation is a function of the maximum operating junction temperature (TJ(MAX)), the thermal resistance of the package ( θJA), and the ambient temperature (TA). The maximum allowable power dissipation is: PD = (TJ(MAX) − TA)/θJA, where TJ(MAX) is 125°C, and TA is the maximum expected ambient temperature. If this dissipation is exceeded, the die temperature will rise above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. OPERATING RATINGS (1) Junction Temperature Range (TJ) −40°C to +125°C ON/OFF Pin 0V to +5V Maximum Input Voltage (Operational) −26V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2991 |
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