Electronic Components Datasheet Search |
|
OPA561 Datasheet(PDF) 11 Page - Texas Instruments |
|
OPA561 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 16 page OPA561 SBOS206D − DECEMBER 2001 − REVISED OCTOBER 2004 www.ti.com 11 PowerPAD package should make their connection to the internal ground plane with a complete connection around the entire circumference of the plated through hole. Figure 8. Via Connection 6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area. The thermal pad area should leave the 13 mil holes exposed. The larger 25 mil holes outside the thermal pad area should be covered with solder mask. 7. Apply solder paste to the exposed thermal pad area and all of the package terminals. 8. With these preparatory steps in place, the PowerPAD IC is simply placed in position and run through the solder reflow operation as any standard surface-mount component. This results in a part that is properly installed. For detailed information on the PowerPAD package including thermal modeling considerations and repair procedures, please see Technical Brief SLMA002, PowerPAD Thermally Enhanced Package, available at www.ti.com. LAYOUT GUIDELINES The OPA561 is a high-speed power amplifier that requires proper layout for best performance. Figure 9 shows an example of proper layout. Keep power-supply leads as short as possible. This will keep inductance low and resistive losses at a minimum. A minimum 18 gauge wire thickness is recommended for power-supply leads. The wire length should be < 8 inches. Figure 9. OPA561 Example Layout Proper power-supply bypassing with low ESR capacitors is essential to achieve good performance. A parallel combination of small ceramic (around 100nF) and bigger (47 µF) non-ceramic bypass capacitors will provide low impedance over a wide frequency range. Bypass capacitors should be placed as close as practical to the power-supply pins of the OPA561. PCB traces conducting high currents, such as from output to load or from the power-supply connector to the power-supply pins of the OPA561 should be kept as wide and as short as possible. This will keep inductance low and also resistive losses to a minimum. The eight holes in the landing pattern for the OPA561 are for the thermal vias that connect the PowerPAD of the OPA561 to the heatsink area on the printed circuit board. The additional four larger vias further enhance the heat conduction into the heatsink area. All traces conducting high currents are very wide for lowest inductance and minimal resistive losses. Note that the negative supply (−VS) pin on the OPA561 is connected through the PowerPAD. This allows for maximum trace width for VOUT and the positive power supply (+VS). |
Similar Part No. - OPA561 |
|
Similar Description - OPA561 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |