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SN65HVD1477DGK Datasheet(PDF) 7 Page - Texas Instruments |
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SN65HVD1477DGK Datasheet(HTML) 7 Page - Texas Instruments |
7 / 42 page SN65HVD1470, SN65HVD1471, SN65HVD1473 SN65HVD1474, SN65HVD1476, SN65HVD1477 www.ti.com SLLSEJ8D – JUNE 2014 – REVISED OCTOBER 2014 7.3 Recommended Operating Conditions IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND MIN NOM MAX UNIT VCC Supply voltage 3 3.3 3.6 V VI Input voltage at any bus pin (separately or common mode) (1) –7 12 V VIH High-level input voltage (Driver, driver enable, and receiver enable inputs) 2 VCC V VIL Low-level input voltage (Driver, driver enable, and receiver enable inputs) 0 0.8 V VID Differential input voltage –12 12 V IO Output current, Driver –60 60 mA IO Output current, Receiver –8 8 mA RL Differential load resistance 54 60 Ω CL Differential load capacitance 50 pF HVD1470, HVD1471 400 kbps 1/tUI Signaling rate HVD1473, HVD1474 20 Mbps HVD1476, HVD1477 50 TA (2) Operating free-air temperature (See the Application and Implementation for thermal –40 125 °C information) TJ Junction Temperature –40 150 °C (1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet. (2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating because of internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which disables the driver outputs when the junction temperature reaches 170°C. 7.4 Thermal Information — D Packages THERMAL METRIC D D UNIT (8 PINS) (14 PINS) RθJA Junction-to-ambient thermal resistance 110.7 83.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.7 42.9 RθJB Junction-to-board thermal resistance 51.3 37.8 ψJT Junction-to-top characterization parameter 9.2 9.3 ψJB Junction-to-board characterization parameter 50.7 37.5 TJ(TSD) Thermal shut-down junction temperature 170 °C 7.5 Thermal Information — DGS and DGK Packages THERMAL METRIC DGS DGK UNIT (10 PINS) (8 PINS) RθJA Junction-to-ambient thermal resistance 165.5 168.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 37.7 62.2 RθJB Junction-to-board thermal resistance 86.4 89.5 ψJT Junction-to-top characterization parameter 1.4 7.4 ψJB Junction-to-board characterization parameter 84.8 87.9 TJ(TSD) Thermal shut-down junction temperature 170 °C Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN65HVD1470 SN65HVD1471 SN65HVD1473 SN65HVD1474 SN65HVD1476 SN65HVD1477 |
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