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SN65LVDS93A Datasheet(PDF) 5 Page - Texas Instruments |
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SN65LVDS93A Datasheet(HTML) 5 Page - Texas Instruments |
5 / 35 page SN65LVDS93A-Q1 www.ti.com SLLSEM1B – FEBRUARY 2015 – REVISED APRIL 2015 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply voltage range, VCC, IOVCC, LVDSVCC, PLLVCC(2) –0.5 4 V Voltage range at any output terminal –0.5 VCC + 0.5 V Voltage range at any input terminal –0.5 IOVCC + 0.5 V Continuous power dissipation See Thermal Information Storage temperature, Tstg –65 150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) All voltages are with respect to the GND terminals. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q200-002(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±1500 (1) AEC Q200-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT Supply voltage, VCC 3 3.3 3.6 LVDS output Supply voltage, LVDSVCC 3 3.3 3.6 PLL analog supply voltage, PLLVCC 3 3.3 3.6 V IO input reference supply voltage, IOVCC 1.62 1.8 / 2.5 / 3.3 3.6 Power supply noise on any VCC terminal 0.1 IOVCC = 1.8 V IOVCC/2 + 0.3 V High-level input voltage, VIH IOVCC = 2.5 V IOVCC/2 + 0.4 V V IOVCC = 3.3 V IOVCC/2 + 0.5 V IOVCC = 1.8 V IOVCC/2 - 0.3 V Low-level input voltage, VIL IOVCC = 2.5 V IOVCC/2 - 0.4 V V IOVCC = 3.3 V IOVCC/2 - 0.5 V Differential load impedance, ZL 90 132 Ω Operating free-air temperature, TA –40 85 °C Virtual junction temperature, TJ 105 °C 6.4 Thermal Information DGG THERMAL METRIC(1) UNIT 56 PINS RθJA Junction-to-ambient thermal resistance 63.4 RθJC(top) Junction-to-case (top) thermal resistance 15.9 RθJB Junction-to-board thermal resistance 32.5 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 32.2 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN65LVDS93A-Q1 |
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