SN65LVDS93A-Q1

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SLLSEM1B – FEBRUARY 2015 – REVISED APRIL 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.5

4

V

Voltage range at any output terminal

–0.5

VCC + 0.5

V

Voltage range at any input terminal

–0.5

IOVCC + 0.5

V

Continuous power dissipation

See Thermal Information

–65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

All voltages are with respect to the GND terminals.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±1500

(1)

AEC Q200-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

NOM

MAX

UNIT

Supply voltage, VCC

3

3.3

3.6

LVDS output Supply voltage, LVDSVCC

3

3.3

3.6

PLL analog supply voltage, PLLVCC

3

3.3

3.6

V

IO input reference supply voltage, IOVCC

1.62

1.8 / 2.5 / 3.3

3.6

Power supply noise on any VCC terminal

0.1

IOVCC = 1.8 V

IOVCC/2 + 0.3 V

IOVCC = 2.5 V

IOVCC/2 + 0.4 V

V

IOVCC = 3.3 V

IOVCC/2 + 0.5 V

IOVCC = 1.8 V

IOVCC/2 - 0.3 V

IOVCC = 2.5 V

IOVCC/2 - 0.4 V

V

IOVCC = 3.3 V

IOVCC/2 - 0.5 V

90

132

Ω

–40

85

°C

105

°C

6.4 Thermal Information

DGG

UNIT

56 PINS

Junction-to-ambient thermal resistance

63.4

Junction-to-case (top) thermal resistance

15.9

Junction-to-board thermal resistance

32.5

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

32.2

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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