BZX84B4V7LT1, BZX84C2V4LT1 Series

http://onsemi.com

7

PACKAGE DIMENSIONS

SOT−23

TO−236AB

CASE 318−09

ISSUE AK

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

D

J

K

L

A

C

B S

H

G

V

3

1

2

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102

0.1197

2.80

3.04

INCHES

B

0.0472

0.0551

1.20

1.40

C

0.0350

0.0440

0.89

1.11

D

0.0150

0.0200

0.37

0.50

G

0.0701

0.0807

1.78

2.04

H

0.0005

0.0040

0.013

0.100

J

0.0034

0.0070

0.085

0.177

K

0.0140

0.0285

0.35

0.69

L

0.0350

0.0401

0.89

1.02

S

0.0830

0.1039

2.10

2.64

V

0.0177

0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.