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ISD4004-12MSI Datasheet(PDF) 5 Page - Winbond |
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ISD4004-12MSI Datasheet(HTML) 5 Page - Winbond |
5 / 28 page ISD4004 Series 1 ISD DETAILED DESCRIPTION SPEECH/SOUND QUALITY The ISD4004 ChipCorder series includes devices offered at 4.0, 5.3, 6.4, and 8.0 KHz sampling fre- quencies, allowing the user a choice of speech quality options. Increasing the duration within a product series decreases the sampling frequency and bandwidth, which affects sound quality. Please refer to the ISD4004 Series Product Summary table on the second page to compare filter pass band and product durations. The speech samples are stored directly into on-chip nonvolatile memory without the digitization and compression associated with other solutions. Di- rect analog storage provides a natural sounding reproduction of voice, music, tones, and sound effects not available with most solid-state solu- tions. DURATION To meet end system requirements, the ISD4004 se- ries products are single-chip solutions at 8, 10, 12, 16 minutes. FLASH STORAGE One of the benefits of ISD’s ChipCorder technology is the use of on-chip nonvolatile memory, which pro- vides zero-power message storage. The message is retained for up to 100 years (typically) without power. In addition, the device can be re-record- ed (typically) over 100,000 times. MICROCONTROLLER INTERFACE A four-wire (SCLK, MOSI, MISO, SS) SPI interface is provided for ISD4004 control and addressing functions. The ISD4004 is configured to operate as a peripheral slave device, with a microcontroller- based SPI bus interface. Read/Write access to all the internal registers occurs through this SPI inter- face. An interrupt signal (INT) and internal read- only Status Register are provided for handshake purposes. PROGRAMMING The ISD4004 series is also ideal for playback-only applications, where single or multiple message Playback is controlled through the SPI port. Once the desired message configuration is created, du- plicates can easily be generated via an ISD pro- grammer. PIN DESCRIPTIONS VOLTAGE INPUTS (VCCA, VCCD) To minimize noise, the analog and digital circuits in the ISD4004 devices use separate power busses. These +3 V busses are brought out to separate pins and should be tied together as close to the supply as possible. In addition, these supplies should be decoupled as close to the package as possible. GROUND INPUTS (VSSA, VSSD) The ISD4004 series utilizes separate analog and digital ground busses. The analog ground (V SSA ) pins should be tied together as close to the pack- age as possible and connected through a low- impedance path to power supply ground. The digital ground (V SSD ) pin should be connected through a separate low-impedance path to pow- er supply ground. These ground paths should be large enough to ensure that the impedance be- tween the V SSA pins and the V SSD pin is less than 3 W. The backside of the die is connected to V SS through the substrate resistance. In a chip-on- board design, the die attach area must be con- nected to V SS or left floating. |
Similar Part No. - ISD4004-12MSI |
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Similar Description - ISD4004-12MSI |
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