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LM4050QCIM3X4LM4050Q Datasheet(PDF) 4 Page - Texas Instruments |
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LM4050QCIM3X4LM4050Q Datasheet(HTML) 4 Page - Texas Instruments |
4 / 42 page LM4050-N, LM4050-N-Q1 SNOS455G – MAY 2000 – REVISED SEPTEMBER 2015 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Ambient Temperature Range –40 85 °C Industrial Temperature Range Junction Temperature Range –40 85 °C Ambient Temperature Range –40 125 °C Extended Temperature Range Junction Temperature –40 125 °C (1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N, TJmax = 150°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package. (2) Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and conditions, see Electrical Characteristics section. 6.4 Thermal Information LM4050-N/-Q1 THERMAL METRIC(1) DBZ (SOT-23) UNIT 3 PINS RθJA Junction-to-ambient thermal resistance 287 °C/W RθJC(top) Junction-to-case (top) thermal resistance 106.6 °C/W RθJB Junction-to-board thermal resistance 57.7 °C/W ψJT Junction-to-top characterization parameter 5.5 °C/W ψJB Junction-to-board characterization parameter 56.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: LM4050-N LM4050-N-Q1 |
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