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LM5141QRGERQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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LM5141QRGERQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 42 page 5 LM5141-Q1 www.ti.com SNVSAJ6A – JULY 2016 – REVISED JULY 2016 Product Folder Links: LM5141-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 All pins ±500 Corner pins (1,6,7,12,13,18,19, and 24) ±750 (1) Recommended Operating Conditions are conditions under which the device is intended to be functional. For specifications and test conditions, see Electrical Characteristics. (2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT VIN Input voltage VIN 3.8 65 V SW to PGND –0.3 65 V HB to SW –0.3 5 5.25 V HO, HOL to SW –0.3 HB + 0.3 V LO, LOL to PGND –0.3 5 5.25 V FB, PG, OSC, SS, RES, DEMB, VCCX –0.3 5 V EN to PGND –0.3 65 V VCC, VDD –0.3 5 5.25 V VOUT, CS 1.5 5 15 V PGND to AGND –0.3 0.3 V Operating junction temperature(2) –40 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM5141-Q1 UNIT RGE (QFN) 24 PINS RθJA Junction-to-ambient thermal resistance 34.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 36.8 °C/W RθJB Junction-to-board thermal resistance 12.1 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 12.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.9 °C/W |
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