LM57

SNIS152E – MAY 2009 – REVISED JULY 2015

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7.4 Thermal Information

LM57

NGR

PW (TSSOP)

UNIT

(WSON/SD)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

71.3

183

°C/W

Junction-to-case (top) thermal resistance

82.8

66

°C/W

Junction-to-board thermal resistance

43.4

111

°C/W

Junction-to-top characterization parameter

2.2

8

°C/W

Junction-to-board characterization parameter

43.7

110

°C/W

Junction-to-case (bottom) thermal resistance

11.9

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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