See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

2

GND

V

CC

5

3

4

B

Y

6

1

A

C

DCK PACKAGE

(TOP VIEW)

3

4

B

2

GND

Y

5

1

A

V

CC

6

C

DRY PACKAGE

(TOP VIEW)

GND

V

CC

A

6

5

4

2

3

B

Y

C

1

YZP PACKAGE

(BOTTOM VIEW)

GND

V

CC

A

B

2

1

3

Y

5

4

6

C

A

B

DSF PACKAGE

(TOP VIEW)

GND

C

Y

V

CC

6

5

4

2

3

1

SN74LVC1G27

www.ti.com

SCES488E – SEPTEMBER 2003 – REVISED DECEMBER 2013

Single 3-Input Positive-NOR Gate

Check for Samples: SN74LVC1G27

1

FEATURES

DESCRIPTION

The SN74LVC1G27 device performs the Boolean

2

•

Available in the Texas Instruments NanoFree™

function Y = A + B + C or Y = A • B • C in positive

Package

logic.

•

NanoFree™

package

technology

is

a

major

•

Inputs Accept Voltages to 5.5 V

breakthrough in IC packaging concepts, using the die

•

as the package.

•

This device is fully specified for partial-power-down

•

outputs,

preventing

damaging

current

backflow

•

±24-mA Output Drive at 3.3 V

through the device when it is powered down.

•

Down Mode, and Back-Drive Protection

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

–

2000-V Human-Body Model (A114-A)

–

200-V Machine Model (A115-A)

–

1000-V Charged-Device Model (C101)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.