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SN74LVC1G3157DCKR Datasheet(PDF) 2 Page - Texas Instruments

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Part # SN74LVC1G3157DCKR
Description  SN74LVC1G3157 Single-Pole Double-Throw Analog Switch
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN74LVC1G3157DCKR Datasheet(HTML) 2 Page - Texas Instruments

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SN74LVC1G3157
SCES424J – JANUARY 2003 – REVISED JUNE 2016
www.ti.com
Product Folder Links: SN74LVC1G3157
Submit Documentation Feedback
Copyright © 2003–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ..................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ...................... 4
6.4
Thermal Information .................................................. 5
6.5
Electrical Characteristics........................................... 5
6.6
Analog Switch Characteristics ................................. 6
6.7
Switching Characteristics ......................................... 6
6.8
Typical Characteristics .............................................. 7
7
Parameter Measurement Information .................. 8
8
Detailed Description ............................................ 13
8.1
Overview ................................................................. 13
8.2
Functional Block Diagram ....................................... 13
8.3
Feature Description................................................. 13
8.4
Device Functional Modes........................................ 13
9
Application and Implementation ........................ 14
9.1
Application Information............................................ 14
9.2
Typical Application ................................................. 14
10
Power Supply Recommendations ..................... 16
11
Layout................................................................... 16
11.1
Layout Guidelines ................................................. 16
11.2
Layout Example .................................................... 16
12
Device and Documentation Support ................. 17
12.1
Documentation Support ........................................ 17
12.2
Receiving Notification of Documentation Updates 17
12.3
Community Resources.......................................... 17
12.4
Trademarks ........................................................... 17
12.5
Electrostatic Discharge Caution ............................ 17
12.6
Glossary ................................................................ 17
13
Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (June 2015) to Revision J
Page
Changed Operating Frequency from 300 MHz to 340 MHz throughout................................................................................. 1
Deleted 200-V Machine Model (A115-A) from Features ........................................................................................................ 1
Updated Device Information table .......................................................................................................................................... 1
Updated pinout images for all packages ................................................................................................................................ 3
Added temperature ranges for Storage temperature, Tstg and Junction temperature, TJ in Absolute Maximum Ratings...... 4
Changed MAX value ±1 to ±0.1 for Ioff and IIN in Electrical Characteristics table................................................................... 5
Added Receiving Notification of Documentation Updates section ....................................................................................... 17
Changes from Revision H (May 2012) to Revision I
Page
Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
Updated document to new TI data sheet format. ................................................................................................................... 1
Updated Features. .................................................................................................................................................................. 1
Changes from Revision G (September 2011) to Revision H
Page
Changed YZP with correct pin labels. ................................................................................................................................... 3
Added Thermal Information table. .......................................................................................................................................... 5
Changed to correct Pin Label "S" ........................................................................................................................................... 5


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