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SN74LVC112ADG4 Datasheet(PDF) 5 Page - Texas Instruments |
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SN74LVC112ADG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 24 page SN74LVC112A www.ti.com SCAS289M – JANUARY 1993 – REVISED DECEMBER 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating 1.65 3.6 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VIH High-level input voltage VCC = 2.3 V to 2.7 V 1.7 V VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 V VCC = 2.7 V to 3.6 V 0.8 VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 IOH High-level output current mA VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 8 IOL Low-level output current mA VCC = 2.7 V 12 VCC = 3 V 24 Δt/Δv Input transition rise or fall rate 10 ns/V TA Operating free-air temperature –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74LVC112A THERMAL METRIC(1) D DB DGV NS PW UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 90.6 107.1 129.0 90.7 122.6 RθJC(to Junction-to-case (top) thermal resistance 50.9 59.6 52.1 48.3 51.4 p) °C/W RθJB Junction-to-board thermal resistance 44.8 54.4 62.0 49.4 64.4 ψJT Junction-to-top characterization parameter 14.7 20.5 6.5 14.6 6.7 ψJB Junction-to-board characterization parameter 44.5 53.8 61.3 49.1 63.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 1993–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN74LVC112A |
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