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LMH1981 Datasheet(PDF) 2 Page - Texas Instruments |
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LMH1981 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 24 page LMH1981 SNLS214H – APRIL 2006 – REVISED MARCH 2013 www.ti.com PIN DESCRIPTIONS Pin No. Pin Name Pin Description 1 REXT Bias Current External Resistor 2, 5, 10 GND Ground 3, 6, 11 VCC Supply Voltage 4 VIN Video Input 7 HSOUT Horizontal Sync Output 8 VSOUT Vertical Sync Output 9 VFOUT Video Format Output 12 CSOUT Composite Sync Output 13 BPOUT Burst/Back Porch Timing Output 14 OEOUT Odd/Even Field Output These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) ESD Tolerance (4) Human Body Model 3.5 kV Machine Model 350V Charge-Device Model 1.0 kV Supply Voltage, VCC 0V to 5.5V Video Input, VIN −0.3V to VCC + 0.3V Storage Temperature Range −65°C to +150°C Lead Temperature (soldering 10 sec.) 300°C Junction Temperature (TJMAX) (5) +150°C Thermal Resistance ( θJA) 52°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics Tables. (2) All voltages are measured with respect to GND, unless otherwise specified. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (5) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/θJA . All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Temperature Range (2) −40°C to +85°C VCC 3.3V −5% to 5V +5% Input Amplitude, VIN-AMPL 140 mV to VCC–VIN-CLAMP (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics Tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/θJA . All numbers apply for packages soldered directly onto a PC board. 2 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH1981 |
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