LMP91050

SNAS517E – NOVEMBER 2011 – REVISED SEPTEMBER 2015

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7.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

±1250

V

Machine Model

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

2.7

5.5

V

–40

105

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

7.4 Thermal Information

LMP91050

DGS (VSSOP)

UNIT

10 PINS

Junction-to-ambient thermal resistance

176

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Electrical Characteristics

= +25°C.

(1)

PARAMETER

TEST CONDITIONS

UNIT

POWER SUPPLY

VDD

Supply voltage

2.7

3.3

5.5

V

IDD

Supply current

All analog block ON

3.1

3.7

4.2

mA

Power-down supply current

All analog block OFF

45

85

121

μA

OFFSET CANCELLATION (OFFSET DAC)

Resolution

256

steps

LSB

All gains

33.8

mV

DNL

-1

2

LSB

Error

Output referred offset error, all gains

±100

mV

Offset adjust range

Output referred, all gains

0.2

VDD – 0.2

V

DAC settling time

480

μs

5

IBIAS

Bias current

200

pA

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

which the device may be permanently degraded, either mechanically or electrically.

(2)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using

statistical quality control (SQC) method.

(3)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

4

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