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TAS2560 Datasheet(PDF) 5 Page - Texas Instruments |
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TAS2560 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 80 page  5 TAS2560 www.ti.com SLASE86B – JUNE 2016 – REVISED AUGUST 2016 Product Folder Links: TAS2560 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range, TA = 25°C (unless otherwise noted) MIN MAX UNIT Battery voltage VBAT –0.3 6 V Analog supply voltage VDD –0.3 2 V I/O supply voltage IOVDD –0.3 3.9 V Boost VBST –0.3 9.2 V Switching SW –0.7 VBST+0.7 V Regulator voltage VREG –0.3 VBST+5 V Digital input voltage –0.3 IOVDD + 0.3 V Output continuous total power dissipation See Thermal Information Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1500 (1) Device is functional down to 2.7 V. See Battery Guard AGC 7.3 Recommended Operating Conditions over operating free-air temperature range, TA = 25°C (unless otherwise noted) MIN NOM MAX UNIT Battery voltage VBAT 2.9(1) 3.6 5.5 V Analog supply voltage VDD 1.65 1.8 1.95 V I/O supply voltage 1.8V IOVDD 1.62 1.8 1.98 V I/O supply voltage 3.3V IOVDD 3 3.3 3.6 V TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TAS2560 UNIT 30 PINS RθJA Junction-to-ambient thermal resistance 56.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.2 RθJB Junction-to-board thermal resistance 8.1 ψJT Junction-to-top characterization parameter 1.2 ψJB Junction-to-board characterization parameter 8.1 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a |
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