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LMR16006YDDCT Datasheet(PDF) 4 Page - Texas Instruments |
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LMR16006YDDCT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page 4 LMR16006 SNVSA24 – OCTOBER 2014 www.ti.com Product Folder Links: LMR16006 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Input Voltages VIN to GND -0.3 65 V SHDN to GND -0.3 65 FB to GND -0.3 7 CB to SW -0.3 7 Output Voltages SW to GND -0.3 65 SW to GND less than 30 ns transients -2 65 TJ Operation Junction temperature -40 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range -55 165 °C V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Buck Regulator VIN 4 60 V CB 4 66 CB to SW -0.3 6 SW -0.3 60 FB 0 5.5 Control SHDN 0 60 Temperature Operating junction temperature range, TJ -40 125 °C (1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, numberof thermal vias, board size, ambient temperature, and air flow. 7.4 Thermal Information over operating free-air temperature range (unless otherwise noted) THERMAL METRIC (1) SOT (6 PINS) UNIT RθJA Junction-to-ambient thermal resistance 102 °C/W RθJCtop Junction-to-case (top) thermal resistance 36.9 RθJB Junction-to board characterization parameter 28.4 |
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