THS3202

SLOS242F – SEPTEMBER 2002 – REVISED JANUARY 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE PACKAGE AND NUMBER

NUMBER OF

CHANNELS

(D)

(DGN)

MARKING

(DGK)

MARKING

2

THS3202D

THS3202DGN

BEP

THS3202DGK

BEV

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (that is, THS3202DR).

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

UNIT

16.5 V

±3 V

(2)

175 mA

Continuous power dissipation

See Package Dissipation Ratings Table

(3)

+150°C

(4)

+125°C

–40°C to +85°C

–65°C to +150°C

HBM

3000 V

ESD ratings:

CDM

1500 V

MM

200 V

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The THS3202 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature

which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the

PowerPAD thermally-enhanced package.

(3)

The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

(4)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

2

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