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THS3217IRGVT Datasheet(PDF) 4 Page - Texas Instruments |
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THS3217IRGVT Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 73 page  4 THS3217 SBOS766B – FEBRUARY 2016 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: THS3217 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Long-term continuous current for electromigration limits. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply, +VCC – (–VCC) 16.2 V Input/output (–VCC) – 0.5 (+VCC) + 0.5 Differential input voltage (IN+ – IN–) ±8 Current Continuous input current (IN+, IN–, VMID_IN, VIN+, VIN–)(2) ±10 mA Continuous output current(2) ±30 Temperature Operating, TA –55 105 °C Junction, TJ –45 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT +VCC Positive supply voltage 4 6 7.9 V –VCC Negative supply voltage –4 –6 –7.9 V TA Operating free-air temperature –40 25 85 °C (1) Thermal impedance reported with backside thermal pad soldered to heat spreading plane. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) THS3217 UNIT RGV (VQFN) 16 PINS RθJA Junction-to-ambient thermal resistance 45 °C/W RθJC(top) Junction-to-case (top) thermal resistance 45 °C/W RθJB Junction-to-board thermal resistance 22 °C/W ψJT Junction-to-top characterization parameter 1 °C/W ψJB Junction-to-board characterization parameter 22 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4 °C/W |
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