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THS4031, THS4032

SLOS224H – JULY 1999 – REVISED JUNE 2016

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Product Folder Links: THS4031 THS4032

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Copyright © 1999–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 5

7.1

Absolute Maximum Ratings ..................................... 5

7.2

ESD Ratings.............................................................. 5

7.3

Recommended Operating Conditions ....................... 5

7.4

Thermal Information – THS4031............................... 6

7.5

Thermal Information – THS4032............................... 6

7.6

7.7

7.8

Typical Characteristics ............................................ 10

8

Parameter Measurement Information ................ 19

9

Detailed Description ............................................ 20

9.1

Overview ................................................................. 20

9.2

Functional Block Diagrams ..................................... 20

9.3

Feature Description................................................. 21

9.4

Device Functional Modes........................................ 24

10

Application and Implementation........................ 25

10.1

Application Information.......................................... 25

10.2

Typical Application ................................................ 25

11

Power Supply Recommendations ..................... 28

12

Layout................................................................... 28

12.1

Layout Guidelines ................................................. 28

12.2

Layout Example .................................................... 28

12.3

General PowerPAD™ Design Considerations...... 29

13

Device and Documentation Support ................. 32

13.1

Device Support .................................................... 32

13.2

Documentation Support ........................................ 32

13.3

Related Links ........................................................ 32

13.4

Receiving Notification of Documentation Updates 32

13.5

Community Resources.......................................... 32

13.6

Trademarks ........................................................... 33

13.7

Electrostatic Discharge Caution ............................ 33

13.8

Glossary ................................................................ 33

14

Mechanical, Packaging, and Orderable

Information ........................................................... 33

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (March 2010) to Revision H

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1

•

Removed obselete JG and FK packages .............................................................................................................................. 1

•

Removed the obselete Ceramic DIP (JG) and Chip Carrier (FK) packages from the data sheet ......................................... 3

•

Deleted Lead temperature row for JG package and case temperature row for FK package from Absolute Maximum

Ratings ................................................................................................................................................................................... 5

•

Changed Thermal Information tables ..................................................................................................................................... 6

•

Removed the Dissipation Ratings table ................................................................................................................................ 9

•

Removed the graphs in the General PowerPAD™ Design Considerations section ........................................................... 29

•

Moved the information in the Related Devices table to the Development Support section ................................................ 32

Changes from Revision F (September 2008) to Revision G

Page

•

Changed units for input voltage noise parameter (+25°C specifications) from nA/

√Hz to nV√Hz ........................................ 7

•

Changes from Revision E (June 2007) to Revision F

Page

•

Deleted bullet point for Stable in Gain of 2 (–1) or greater ................................................................................................... 1

•

Editorial changes to paragraph format ................................................................................................................................. 28