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ADS8881 Datasheet(PDF) 4 Page - Texas Instruments |
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ADS8881 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 70 page  4 THS4551 SBOS778A – APRIL 2016 – REVISED AUGUST 2016 www.ti.com Product Folder Links: THS4551 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Solder the exposed thermal pad (RGT package) to a heat-spreading power or ground plane. This pad is electrically isolated from the die, but must be connected to a power or ground plane and not floated. Pin Functions PIN I/O DESCRIPTION NAME NO. RGT(1) RUN DGK FB– 1 — — O Inverting (negative) output feedback FB+ 4 — — O Noninverting (positive) output feedback IN– 3 6 1 I Inverting (negative) amplifier input IN+ 2 4 8 I Noninverting (positive) amplifier input NC — 2, 8 — — No internal connection OUT– 11 1 5 O Inverting (negative) amplifier output OUT+ 10 9 4 O Noninverting (positive) amplifier output PD 12 3 7 I Power down. PD = logic low = power off mode; PD = logic high = normal operation. VOCM 9 7 2 I Common-mode voltage input VS– 13-16 5 6 I Negative power-supply input VS+ 5, 6, 7, 8 10 3 I Positive power-supply input (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Long-term continuous current for electro-migration limits. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply voltage, (VS+) – (VS–) 5.5 V Input/output voltage range (VS–) – 0.5 (VS+) + 0.5 Differential input voltage ±1 Current Continuous input current ±10 mA Continuous output current(2) ±20 Continuous power dissipation See the Thermal Information and Thermal Analysis sections Temperature Maximum junction 150 °C Operating free-air, TA –40 125 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1250 |
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