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THS4541IRUNT Datasheet(PDF) 4 Page - Texas Instruments |
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THS4541IRUNT Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 61 page  THS4541 SLOS375A – AUGUST 2014 – REVISED SEPTEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, Vs+ – Vs– 5.5 V Voltage Input/output voltage range (Vs–) – 0.5 (Vs+) + 0.5 V Differential input voltage ±1 V Continuous input current ±20 mA Current Continuous output current ±80 mA Continuous power dissipation See Thermal Information table and Thermal Analysis section Maximum junction temperature 150 °C Temperature Operating free-air temperature range –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 Electrostatic V(ESD) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500 V discharge Machine model(2) –150 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Vs+ Single-supply voltage 2.7 5 5.4 V TA Ambient temperature –40 25 125 °C 7.4 Thermal Information THS4541 THERMAL METRIC(1) RGT (VQFN) RUN (WQFN) UNIT 16 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 52 146 RθJC(top) Junction-to-case (top) thermal resistance 69 75 RθJB Junction-to-board thermal resistance 25 39 °C/W ψJT Junction-to-top characterization parameter 2.7 14 ψJB Junction-to-board characterization parameter 25 105 RθJC(bot) Junction-to-case (bottom) thermal resistance 9.3 47 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: THS4541 |
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