FEATURES

Low cost

Diffus ed junction

Low leakage

Low forward voltage drop

MECHANICAL DATA

Term inals: Axial lead ,solderable per

MIL- STD-750,Method 2026

Polarity: Color band denotes cathode

Weight: 0.041 ounces,1.15gram s

Mounting pos ition: Any

Ratings at 25

　ambient temperature unles s otherwise s pecified.

Single phas e,half wave,60 Hz,resis tive or inductive load. For capacitive load,derate by 20%.

EGP

30C

EGP

30D

UNITS

Maximum recurrent peak reverse voltage

V

Maximum RMS voltage

V

Maximum DC blocking voltage

V

Maximum average f orw ard rectified current

9.5mm lead length,

@T

Peak f orw ard surge current

8.3ms single half -sine-w ave

superimposed on rated load

Maximum instantaneous forw ard voltage

@ 3.0 A

V

Maximum reverse current

@T

at rated DC blocking voltage

@T

Maximum reverse recovery time (Note1)

ns

Typical junction capacitance

(Note2)

pF

Operating junction temperature range

Storage temperature range

VOLTAGE RANGE: 50 --- 800 V

CURRENT: 3.0 A

35

70

105

140

210

280

420

560

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

3.Thermal resistance junction to ambient.

NOTE: 1. Measured with I

2. Measured at 1.0MHz and applied rev erse v oltage of 4.0V DC.

- 55 ---- + 150

A

- 55 ---- + 150

DO - 27

EGP30A(Z)---EGP30K(Z)

8.5

EGP

30B

A

High surge current capability

HIGH EFFICIENCY RECTIFIERS

Eas ily cleaned with alcohol,Isopropanol

and sim ilar s olvents

3.0

50

100

150

200

300

400

600

800

The plas tic m aterial carries U/L recognition 94V-0

Case:JEDEC DO--27,m olded plas tic

EGP

30A

50

100

150

200

300

400

600

800

EGP

30F

20

Typical thermal resistance

(Note3)

A

/W

125.0

0.95

1.25

1.7

5.0

100.0

EGP EGP EGP

30G

30J

30K

95

75

50

75

/W

Typical thermal resistance

(Note4)

4.Thermal resistance junction to lead.

Dimensions in millimeters

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