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LMV651 Datasheet(PDF) 4 Page - Texas Instruments |
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LMV651 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 LMV651, LMV652, LMV654 SNOSAI7K – SEPTEMBER 2005 – REVISED MAY 2016 www.ti.com Product Folder Links: LMV651 LMV652 LMV654 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(MAX, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board. 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Differential input VID ±0.3 Supply voltage (VS = V + - V−) 6 Input or output pin voltage V− − 0.3 V+ + 0.3 V Soldering information Infrared or convection (20 sec) 235 °C Wave soldering lead temperature (10 sec) 260 Junction temperature(3) 150 °C Storage temperature, Tstg −65 150 °C (1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7 (2) Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22- C101-C (ESD FICDM std. of JEDEC). 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±2000 V Machine model(2) ±100 6.3 Recommended Operating Conditions MIN MAX UNIT Temperature −40 125 °C Supply voltage 2.7 5.5 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LMV651 LMV652 LMV653 UNIT DCK (SC70) DBV (SOT-23) DGK (VSSOP) PW (TSSOP) 5 PINS 5 PINS 8 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 303.5 214.2 200.3 134.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 135.5 173.3 89.1 60.9 °C/W RθJB Junction-to-board thermal resistance 81.1 72.5 120.9 77.3 °C/W ψJT Junction-to-top characterization parameter 8.4 56.7 21.7 11.5 °C/W ψJB Junction-to-board characterization parameter 80.4 71.9 119.4 76.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W |
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