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LMV715-N Datasheet(PDF) 4 Page - Texas Instruments |
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LMV715-N Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 25 page  4 LMV710-N, LMV711-N, LMV715-N SNOS519K – APRIL 2000 – REVISED AUGUST 2016 www.ti.com Product Folder Links: LMV710-N LMV715-N Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Shorting circuit output to V+ will adversely affect reliability. (4) Shorting circuit output to V− will adversely affect reliability. (5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PCB. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Differential input voltage ±Supply voltage Voltage at input or output pin (V–) − 0.4 (V+) + 0.4 V Supply voltage (V+ - V −) 5.5 V Output short circuit to V+ See(3) Output short circuit to V− See(4) Current at input pin ±10 mA Mounting temperature, infrared or convection (20 sec) 235 °C Junction temperature, TJ(MAX) (5) 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human-body model, 1.5 kΩ in series with 100 pF. (3) Machine model, 0 Ω in series with 100 pF. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM)(1)(2) ±2000 V Machine model (MM)(3) ±100 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage 2.7 5 V Temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LMV710-N LMV711-N LMV715-N UNIT DBV (SOT-23) DBV (SOT-23) DBV (SOT-23) 5 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 265 265 265 °C/W RθJC(top) Junction-to-case (top) thermal resistance 131.6 139 156.6 °C/W RθJB Junction-to-board thermal resistance 35.1 38.5 32.8 °C/W ψJT Junction-to-top characterization parameter 22.2 28.6 34 °C/W ψJB Junction-to-board characterization parameter 34.5 37.9 32.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W |
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