TLC2872Z, TLC2872Y

Advanced LinCMOS

™ RAIL-TO-RAIL

DUAL OPERATIONAL AMPLIFIERS

SLOS117 – OCTOBER 1992

1

POST OFFICE BOX 655303

–40

°C to 150°C

Includes Negative Rail

300

description

The TLC2872Z is a dual rail-to-rail output

operational amplifier manufactured using Texas

Instruments

Advanced

LinCMOS

™ process.

These devices offer comparable ac performance

while having better noise, input offset voltage

and power dissipation than existing CMOS

operational amplifiers. In addition, the common-

mode input voltage range is wider than typical

standard

CMOS

type

amplifiers.

To

take

advantage of this improvement in performance,

making this device available for a wider range of

maximum input offset voltage test limit of

±5 mV.

The Advanced LinCMOS

™ process uses a

silicon-gate technology to obtain input offset voltage stability with temperature and time that far exceeds that

obtainable using metal-gate technology. Also, this technology makes possible input impedance levels that meet

or exceed levels offered by top-gate JFET and expensive dielectric-isolated devices.

The TLC2872Z, manufactured using Texas Instruments high-temperature process flow, allows extended

temperature operation up to 150

°C in a plastic package. This adds extra reliability at the extended temperature

and reduces the need for expensive hermetically sealed ceramic packages.

The TLC2872Z, which exhibits high input impedance and low noise, is excellent for small signal conditioning

of high impedance sources, such as piezoelectric transducers. In addition, the rail-to-rail output feature with

single or split supplies makes this device a great choice for inputs to ADCs in either the unipolar or bipolar mode

of operation. This feature, combined with its temperature performance, makes the TLC2872Z ideal for

sonobuoys, pressure sensors, temperature controls, active VR sensors, accelerometers, and many other

applications.

AVAILABLE OPTIONS

VIOmax

PACKAGED DEVICES

CHIP FORM

TA

VIOmax

AT 25

°C

SMALL OUTLINE

(D)

PLASTIC DIP

(P)

CHIP FORM

(Y)

–40

°C to 150°C

2.5 mV

TLC2872ZD

TLC2872ZP

TLC2872Y

The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2872DR).

Copyright

© 1992, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Advanced LinCMOS is a trademark of Texas Instruments Incorporated.

VDD – Supply Voltage – V

10

8

6

4

46

8

12

14

16

10

12

14

16

MAXIMUM OUTPUT VOLTAGE

vs

SUPPLY VOLTAGE

TA = 25°C

VO = VDD/2

IO = 50 µA

1

2

3

4

8

7

6

5

1OUT

1IN –

1IN +

2OUT

2IN –

2IN +

D OR P PACKAGE

(TOP VIEW)