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TLC5916QDRQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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TLC5916QDRQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 34 page TLC5916-Q1, TLC5917-Q1 www.ti.com SLVS814A – JANUARY 2008 – REVISED MAY 2015 7.4 Thermal Information TLC591x-Q1 THERMAL METRIC(1) D (SOIC) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 86.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 47.7 °C/W RθJB Junction-to-board thermal resistance 43.9 °C/W ψJT Junction-to-top characterization parameter 11.9 °C/W ψJB Junction-to-board characterization parameter 43.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLC5916-Q1 TLC5917-Q1 |
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