LP3981

SNVS159H – OCTOBER 2001 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

IN, EN

−0.3

6.5

V

OUT, OUT-SENSE

6.5

V

Junction temperature

150

°C

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

2.7

6

V

0

V

Junction temperature

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

6.4 Thermal Information

LP3981

DGK (VSSOP)

NGC (WSON)

UNIT

8 PINS

6 PINS

Junction-to-ambient thermal resistance, High K

177

56.5

°C/W

Junction-to-case (top) thermal resistance

67.7

76.8

°C/W

Junction-to-board thermal resistance

97.4

30.9

°C/W

Junction-to-top characterization parameter

10.8

3.3

°C/W

Junction-to-board characterization parameter

96

31

°C/W

Junction-to-case (bottom) thermal resistance

N/A

10.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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