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TLE2082ACP Datasheet(PDF) 4 Page - Texas Instruments |
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TLE2082ACP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 79 page TLE208x, TLE208xA, TLE208xY EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2081Y chip information This chip, when properly assembled, displays characteristics similar to the TLE2081. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF THE CHIP. + – OUT IN + IN – VCC+ (6) (3) (2) (5) (1) (7) (4) OFFSET N1 OFFSET N2 VCC – 58 85 (1) (2) (4) (5) (6) (7) (8) (3) |
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