2

CAT1161/2

Doc. No. 3002, Rev. D

D.C. OPERATING CHARACTERISTICS

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

Power Supply Current

3

mA

Standby Current

40

µA

50

µA

Input Leakage Current

2

µA

Output Leakage Current

10

µA

Input Low Voltage

-1

V

Input High Voltage

V

Output Low Voltage (SDA)

0.4

V

ABSOLUTE MAXIMUM RATINGS

Temperature Under Bias ................. –55

°C to +125°C

Storage Temperature ....................... –65

°C to +150°C

Voltage on any Pin with

Package Power Dissipation

°C) ................................... 1.0W

Lead Soldering Temperature (10 secs) ............ 300

°C

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation

of the device at these or any other conditions outside of

those listed in the operational sections of this specifica-

tion is not implied. Exposure to any absolute maximum

rating for extended periods may affect device perfor-

mance and reliability.

RELIABILITY CHARACTERISTICS

Symbol

Parameter

Reference Test Method

Min

Max

Units

Endurance

MIL-STD-883, Test Method 1033

1,000,000

Cycles/Byte

Data Retention

MIL-STD-883, Test Method 1008

100

Years

ESD Susceptibility

MIL-STD-883, Test Method 3015

2000

Volts

Latch-Up

JEDEC Standard 17

100

mA

Note:

(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC

(2) Output shorted for no more than one second. No more than one output shorted at a time.

(3) This parameter is tested initially and after a design or process change that affects the parameter.

PIN FUNCTIONS

Pin No. Pin Name

Function

1

DC

Do Not Connect

2

RESET

Active Low Reset I/O

3

WP

Write Protect

4

GND

Ground

5

SDA

Serial Data/Address

6

SCL

Clock Input

7

RESET

Active High Reset I/O

Power Supply