UC5612

SLUS164A − MARCH 1997 − REVISED OCTOBER 2003

2

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DESCRIPTION (CONT.)

Internal circuit trimming is utilized, first to trim the impedance to a 5% tolerance, and then most importantly, to

trim the output current to a 5% tolerance, as close to the maximum SCSI specification as possible. This

maximizes the noise margin in fast SCSI operation. Other features include thermal shutdown and current limit.

This device is offered in low thermal resistance versions of the industry standard 16-pin narrow body SOIC,

16-pin DIL and 24-pin TSSOP.

ORDERING INFORMATION

TA

PACKAGED DEVICE

{

PACKAGED DEVICE

{

PACKAGED DEVICE

{

TA

DIL-16 (N)

SOIC-16 (DP)

TSSOP-24 (PWP)

0

°C to 70°C

UC5612N

UC5612DP

UC5612PWP

† The TSSOP packages are available taped and reeled. Add TR suffix to device type (e.g. UC5612PWPTR) to order quantities

of 2,000 devices per reel.

CONNECTION DIAGRAM

DIL-16 (Top View)

N Package

SOIC-16 (Top View)

DP Package

TSSOP-24 (Top View)

PWP Package

DISCNCT

N/C

N/C

GND*

GND*

LINE6

LINE8

SGND*

GND*

GND*

LINE9

N/C

GND*

LINE7

GND*

LINE1

GND*

GND*

TRMPWR

12

11

10

9

8

7

6

5

4

3

2

1

13

14

15

16

17

18

19

20

21

22

23

24

LINE4

LINE5

REG

LINE2

LINE3

* DP package pin 5 serves as signal

ground; pins 4, 12, and 13 serve as

heatsink/ground.

* PWP package pin 9 serves as signal

ground; pins 5, 6, 7, 8, 17, 18, 19 and

20 serve as heatsink/ground.