UCC27200A, UCC27201A

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SLUSAF9B – FEBRUARY 2011 – REVISED JULY 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

20

V

–0.3

20

V

DC

–0.3

V

–2

DC

V

<20)

DC

–1

120

V

–18

120

–0.3

120

V

Voltage On HB-HS

–0.3

120

V

–40

150

°C

Lead temperature (soldering, 10 sec.)

300

°C

(4)

1.3

W

(4)

2.7

W

(4)

3.3

W

(4)

2.86

W

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Values are verified by characterization and are not production tested.

(4)

This data was taken using the JEDEC proposed high-K test PCB. See the THERMAL CHARACTERISTICS section for details.

6.2 ESD Ratings

VALUE

UNIT

2000

Electrostatic discharge

V

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

NOM

MAX

UNIT

Supply voltage

8

12

17

V

Voltage on HS

–1

105

V

Voltage on HS, (repetitive pulse <100 ns)

–15

110

V

Voltage on HB

V

115

Voltage slew rate on HS

50

V / ns

Operating junction temperature range

–40

140

°C

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