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TLV70536YFPR Datasheet(PDF) 5 Page - Texas Instruments |
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TLV70536YFPR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 33 page TLV705, TLV705P www.ti.com SBVS151E – DECEMBER 2010 – REVISED MAY 2015 6 Specifications 6.1 Absolute Maximum Ratings Specified at TJ = –40°C to 125°C, unless otherwise noted. All voltages are with respect to GND. (1) MIN MAX UNIT VIN –0.3 6 V Voltage(2) VEN –0.3 6 V VOUT –0.3 6 V Maximum output current IOUT Internally limited Output short-circuit duration Indefinite Operating junction, TJ –55 150 °C Temperature Storage, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground pin. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2 5.5 V VOUT Output voltage 0.7 4.8 V IOUT Output current 0 200 mA TJ Junction temperature –40 125 °C 6.4 Thermal Information TLV705x YFF, YFP YFM THERMAL METRIC(1) UNIT (DSBGA) (PicoStar) 4 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 160 191.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 80 3.1 °C/W RθJB Junction-to-board thermal resistance 90 36.5 °C/W ψJT Junction-to-top characterization parameter 0.5 2.8 °C/W ψJB Junction-to-board characterization parameter 78 26.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLV705 TLV705P |
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