TLV705, TLV705P

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SBVS151E – DECEMBER 2010 – REVISED MAY 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

6

V

–0.3

6

V

–0.3

6

V

Maximum output current

Internally limited

Output short-circuit duration

Indefinite

–55

150

°C

Temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground pin.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2

5.5

V

Output voltage

0.7

4.8

V

Output current

0

200

mA

Junction temperature

–40

125

°C

6.4 Thermal Information

TLV705x

YFF, YFP

YFM

UNIT

(DSBGA)

(PicoStar)

4 PINS

4 PINS

Junction-to-ambient thermal resistance

160

191.7

°C/W

Junction-to-case (top) thermal resistance

80

3.1

°C/W

Junction-to-board thermal resistance

90

36.5

°C/W

Junction-to-top characterization parameter

0.5

2.8

°C/W

Junction-to-board characterization parameter

78

26.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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