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TLV803 Datasheet(PDF) 2 Page - Texas Instruments |
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TLV803 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 14 page TLV810M, TLV810R TLV810S, TLV810Z SBVS158A – APRIL 2011 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) SPECIFIED THRESHOLD PACKAGE- PACKAGE OPERATING PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT VOLTAGE LEAD DESIGNATOR TEMPERATURE MARKING INFORMATION QUANTITY TLV810ZDBZR Tape and Reel, 3000 TLV810Z 2.25 V SOT23-3 DBZ –40°C to +125°C VOVQ TLV810ZDBZT Tape and Reel, 250 TLV810RDBZR Tape and Reel, 3000 TLV810R 2.64 V SOT23-3 DBZ –40°C to +125°C VOWQ TLV810RDBZT Tape and Reel, 250 TLV810SDBZR Tape and Reel, 3000 TLV810S 2.93 V SOT23-3 DBZ –40°C to +125°C VOXQ TLV810SDBZT Tape and Reel, 250 TLV810MDBZR Tape and Reel, 3000 TLV810M 4.38 V SOT23-3 DBZ –40°C to +125°C VOYQ TLV810MDBZT Tape and Reel, 250 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the device product folders at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). VALUE MIN MAX UNIT VDD (2) 0 7 V Voltage All other pins(2) –0.3 7 V Maximum low output current, IOL 5 mA Maximum high output current, IOH –5 mA Current Input clamp current, IIK (VI < 0 or VI > VDD) ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ±20 mA Operating free-air temperature range, TA –40 +125 °C Temperature Storage temperature range, Tstg –65 +150 °C Soldering temperature +260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h continuously. THERMAL INFORMATION TLV810 THERMAL METRIC(1) DBZ UNITS 3 PINS θJA Junction-to-ambient thermal resistance 286.9 θJCtop Junction-to-case (top) thermal resistance 105.6 θJB Junction-to-board thermal resistance 124.4 °C/W ψJT Junction-to-top characterization parameter 25.8 ψJB Junction-to-board characterization parameter 107.9 θJCbot Junction-to-case (bottom) thermal resistance — (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Copyright © 2011, Texas Instruments Incorporated |
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