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UCC387DP Datasheet(PDF) 2 Page - Texas Instruments

Part # UCC387DP
Description  LOW-DROPOUT 200mA LINEAR REGULATOR
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

UCC387DP Datasheet(HTML) 2 Page - Texas Instruments

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UCC386, UCC387, UCC388
LOW DROPOUT 200mA LINEAR REGULATOR
SLUS377B - JULY 1999 - REVISED MAY 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
The UCC386 has an on-chip resistor network for preset to regulate at 3.3 V, while the UCC387 has a fixed 5-V
output. The UCC388 requires an external resistor network that can be programmed for output voltages down
to 1.25 V. The output voltage is regulated to 1.5% at room temperature and better than 2.5% over the entire
operating temperature range.
Short-circuit current is internally limited. The device responds to a sustained overcurrent condition by limiting
the duty cycle of the load to 12.5% typical. This drastically reduces the power dissipation during short circuit
such that heat sinking, if at all required, must only accommodate normal operation.
Internal power dissipation is further controlled with thermal overload protection circuitry. Thermal shutdown
occurs if the junction temperature exceeds 140
°C. The chip remains in the off state until the temperature drops
to 115
°C.
Pulling OFFB low commands a low-power shutdown mode, which requires less than 2-
µA quiescent current.
These devices are available in the 8-pin TSSOP (PW) and 8-pin SOIC (DP) surface-mount power packages.
For other packaging options consult the factory.
AVAILABLE OPTIONS
TA
OUTPUT VOLTAGE (V)
PACKAGE DEVICES
TA
MIN
TYP
MAX
SOIC-8 (DP)
TSSOP-8 (PW)
3.22
3.30
3.38
UCC386DP
UCC386PW
0
°C to 70°C
4.785
5.000
5.125
UCC387DP
UCC387PW
ADJ
UCC388DP
UCC388PW
† All package types are available taped and reeled. Add TR suffix to device type (e.g.
UCC386DPTR) to order quantities of 3000 devices per reel.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
VIN
9 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OFFB
–0.3 V to VIN 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature, TJ
–55
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (Soldering, 10 sec)
300
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and
considerations of packages. All voltages are referenced to GND.
electrical characteristics, TA = TJ = 0 C to 70 C, VIN = VOUT+1.5 V, IOUT = 0 mA, COUT = 0.1 F (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
UCC386 Fixed 3.3 V Output
Output voltage
TA = 25°C
3.25
3.3
3.35
V
Output voltage
Over temperature
3.22
3.3
3.38
V
Line regulation
VIN = 3.45 V to 8.5 V,
IOUT = 10 mA
13
25
mV
Load regulation
IOUT = 1 mA to 200 mA
5
10
mV
Output noise voltage
TJ = 25°C,
BW = 10 Hz to 10 kHz
200
µVRMS
Dropout voltage VIN VOUT
IOUT = 200 mA,
VOUT = 3.20 V
200
500
mV
Dropout voltage, VIN-VOUT
IOUT = 50 mA,
VOUT = 3.20 V
50
mV


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