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UCC387DP Datasheet(PDF) 2 Page - Texas Instruments |
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UCC387DP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 9 page UCC386, UCC387, UCC388 LOW DROPOUT 200mA LINEAR REGULATOR SLUS377B - JULY 1999 - REVISED MAY 2000 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description (continued) The UCC386 has an on-chip resistor network for preset to regulate at 3.3 V, while the UCC387 has a fixed 5-V output. The UCC388 requires an external resistor network that can be programmed for output voltages down to 1.25 V. The output voltage is regulated to 1.5% at room temperature and better than 2.5% over the entire operating temperature range. Short-circuit current is internally limited. The device responds to a sustained overcurrent condition by limiting the duty cycle of the load to 12.5% typical. This drastically reduces the power dissipation during short circuit such that heat sinking, if at all required, must only accommodate normal operation. Internal power dissipation is further controlled with thermal overload protection circuitry. Thermal shutdown occurs if the junction temperature exceeds 140 °C. The chip remains in the off state until the temperature drops to 115 °C. Pulling OFFB low commands a low-power shutdown mode, which requires less than 2- µA quiescent current. These devices are available in the 8-pin TSSOP (PW) and 8-pin SOIC (DP) surface-mount power packages. For other packaging options consult the factory. AVAILABLE OPTIONS TA OUTPUT VOLTAGE (V) PACKAGE DEVICES TA MIN TYP MAX SOIC-8 (DP) TSSOP-8 (PW) 3.22 3.30 3.38 UCC386DP UCC386PW 0 °C to 70°C 4.785 5.000 5.125 UCC387DP UCC387PW ADJ UCC388DP UCC388PW † All package types are available taped and reeled. Add TR suffix to device type (e.g. UCC386DPTR) to order quantities of 3000 devices per reel. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† VIN 9 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OFFB –0.3 V to VIN 0.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage Temperature, Tstg –65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Junction Temperature, TJ –55 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead Temperature (Soldering, 10 sec) 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. All voltages are referenced to GND. electrical characteristics, TA = TJ = 0 C to 70 C, VIN = VOUT+1.5 V, IOUT = 0 mA, COUT = 0.1 F (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS UCC386 Fixed 3.3 V Output Output voltage TA = 25°C 3.25 3.3 3.35 V Output voltage Over temperature 3.22 3.3 3.38 V Line regulation VIN = 3.45 V to 8.5 V, IOUT = 10 mA 13 25 mV Load regulation IOUT = 1 mA to 200 mA 5 10 mV Output noise voltage TJ = 25°C, BW = 10 Hz to 10 kHz 200 µVRMS Dropout voltage VIN VOUT IOUT = 200 mA, VOUT = 3.20 V 200 500 mV Dropout voltage, VIN-VOUT IOUT = 50 mA, VOUT = 3.20 V 50 mV |
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