UCC3588J datasheet(2/15 Pages) TI1

Part #	UCC3588J

Description	5-BIT PROGRAMMABLE OUTPUT BICMOS POWER SUPPLY CONTROLLER

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UCC3588

5BIT PROGRAMMABLE OUTPUT BiCMOS

POWER SUPPLY CONTROLLER

SLUS311A – JULY 1999 – REVISED AUGUST 2000

2

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

application diagram

4

11

15

5

6

7

8

3

16

12

9

10

1

2

14

13

UCC3588

VCC

DRVHI

PWRGOOD

D0

D1

D2

D3

D4

SS/ENBL

GND

COMP

VFB

VSENSE

ISNS

DRVLO

RT

R2

47 k

C5

33 nF

C16

10

µF

R1

10 k

C4

C3

C2

C1

++

RTN

D0

D1

D2

D3

D4

R3

200 k

C6

220 pF

C7 22 pF

R7

15 k

C13

1 nF

R8

20 k

R4

3

Ω

R5

3

Ω

R6

0.003

Ω

C15

150

µF

C12

C11

C10

C8

+

RTN

VOUT

L1

1.6

µH

Q2

IRL3103

Q1

IRL3103

D2

D1

12 V IN

5 V IN

C8–C12 1500

µF

++

+

C1–C4

500

µF

+

C14

150

µF

C9

+

UDG-98158

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage VCC

15 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Gate drive current, 50% duty cycle

1 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, VSENSE, VFB, SS, COMMAND, COMP

5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, D0, D1, D2, D3, D4

6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input current, RT, COMP

5 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

‡ Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and

considerations of packages. All voltages are referenced to GND.

thermal data

Plastic DIP package,

thermal resistance junction to leads,

Θjc

45

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

thermal resistance junction to ambient,

Θja

90

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ceramic DIP package,

thermal resistance junction to leads,

Θjc

28

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

thermal resistance junction to ambient,

Θja

120

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Standard surface mount package,

thermal resistance junction to leads,

Θjc

35

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

thermal resistance junction to ambient,

Θja

120

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NOTE The above numbers for

Θja and Θjc are maximums for the limiting thermal resistance of the package in a standard mounting configuration.

The

Θja numbers are meant to be guidelines for the thermal performance of the device and PC board system. All of the above numbers

assume no ambient airflow, see the packaging section of Unitrode Product Data Handbook for more details.

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