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UCC3803PW Datasheet(PDF) 6 Page - Texas Instruments |
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UCC3803PW Datasheet(HTML) 6 Page - Texas Instruments |
6 / 56 page 6 UCC1800, UCC1801, UCC1802, UCC1803, UCC1804, UCC1805 UCC2800, UCC2801, UCC2802, UCC2803, UCC2804, UCC2805 UCC3800, UCC3801, UCC3802, UCC3803, UCC3804, UCC3805 SLUS270E – MARCH 1999 – REVISED JUNE 2016 www.ti.com Product Folder Links: UCC1800 UCC1801 UCC1802 UCC1803 UCC1804 UCC1805 UCC2800 UCC2801 UCC2802 UCC2803 UCC2804 UCC2805 UCC3800 UCC3801 UCC3802 UCC3803 UCC3804 UCC3805 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) In normal operation, VCC is powered through a current-limiting resistor. Absolute maximum of 12 V applies when VCC is driven from a low impedance source, such that ICC does not exceed 30 mA (which includes the gate drive current requirement). The resistor must be sized so that the VCC voltage, under operating conditions, is below 12 V but above the turnoff threshold. (3) Return the minimum (lesser) value of the two. 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC voltage(2) 12 V VCC current(2) 30 mA OUT current ±1 A OUT energy (capacitive load) 20 µJ Analog inputs (FB, CS, RC, COMP) –0.3 6.3 or VCC + 0.3(3) V Power dissipation at TA < 25°C N or J package 1 W D package 0.65 L package 1.375 Lead temperature, soldering (10 s) 300 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.2 ESD Ratings VALUE UNIT D, N, OR J PACKAGES V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 L PACKAGE V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VVCC VCC bias supply voltage from low impedance source 11 V VFB, VCS, VRC, VCOMP Voltage on analog pins –0.1 6 or VVCC V VOUT Gate driver output voltage –0.1 VVCC V IVCC Supply bias current 25 mA IOUT Average OUT pin current 20 mA IREF REF pin output current 5 mA fOSC Oscillator frequency 1 MHz TA Operating free-air temperature –55 125 °C |
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