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TM4CN64EFN Datasheet(PDF) 9 Page - Texas Instruments

Part # TM4CN64EFN
Description  SYNCHRONOUS DYNAMIC RAM MODULES
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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TM4CN64EFN Datasheet(HTML) 9 Page - Texas Instruments

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TM2CN64EFN 2097152 BY 64BIT
TM4CN64EFN 4194304 BY 64BIT
SYNCHRONOUS DYNAMIC RAM MODULES
SMMS714 − MAY 1998
9
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
serial presence detect
The serial presence detect (SPD) is contained in a 256-byte serial EEPROM located on the module. The SPD
nonvolatile EEPROM contains various data such as module configuration, SDRAM organization, and timing
parameters (see Table 1 and Table 2). Only the first 128 bytes are programmed by Texas Instruments, while
the remaining 128 bytes are available for customer use. Programming is done through an IIC bus using the clock
(SCL) and data (SDA) signals. All Texas Instruments modules comply with the current JEDEC SPD Standard.
See the Texas Instruments Serial Presence Detect Technical Reference (literature number SMMU001) for
further details.
SPD contents for the TMxCN64EFN devices are listed in the following tables:
Table 1
TM2CN64EFN
Table 2
TM4CN64EFN
Table 1. Serial Presence Detect Data for the TM2CN64EFN
BYTE
DESCRIPTION OF FUNCTION
TM2CN64EFN-10
BYTE
NO.
DESCRIPTION OF FUNCTION
ITEM
DATA
0
Defines number of bytes written into serial memory during module manufacturing
128 bytes
80h
1
Total number of bytes of SPD memory device
256 bytes
08h
2
Fundamental memory type (FPM, EDO, SDRAM, . . .)
SDRAM
04h
3
Number of row addresses on this assembly
11
0Bh
4
Number of column addresses on this assembly
9
09h
5
Number of module rows on this assembly
1 bank
01h
6
Data width of this assembly
64 bits
40h
7
Data width continuation
00h
8
Voltage interface standard of this assembly
LVTTL
01h
9
SDRAM cycle time at maximum supported CAS latency (CL), CL = X
tCK = 10 ns
A0h
10
SDRAM access from clock at CL = X
tAC = 7.5 ns
75h
11
DIMM configuration type (non-parity, parity, error correcting code [ECC])
Non-Parity
00h
12
Refresh rate / type
15.6
µs/
self-refresh
80h
13
SDRAM width, primary DRAM
x8
08h
14
Error-checking SDRAM data width
N/A
00h
15
Minimum clock delay, back-to-back random column addresses
1 CK cycle
01h
16
Burst lengths supported
1, 2, 4, 8
0Fh
17
Number of banks on each SDRAM device
2 banks
02h
18
CAS latencies supported
2, 3
06h
19
CS latency
0
01h
20
Write latency
0
01h
21
SDRAM module attributes
Non-buffered/
Non-registered
00h
22
SDRAM device attributes: general
VDD tolerance =
(+10%),
Burst read / write,
precharge all,
auto precharge
0Eh
23
Minimum clock cycle time at CL = X − 1
tCK = 15 ns
F0h
24
Maximum data-access time from clock at CL = X − 1
tAC = 8 ns
80h


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