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TPS78625DCQ Datasheet(PDF) 11 Page - Texas Instruments

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Part # TPS78625DCQ
Description  ULTRALOW-NOISE, HIGH PSRR, FAST RF 1.5 A LOW-DROPOUT LINEAR REGULATORS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS78625DCQ Datasheet(HTML) 11 Page - Texas Instruments

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T
J +
T
A )
P
Dmax x R
θJC ) RθCS ) RθSA
P
D
max + VI(avg) * VO(avg)
I
O(avg) )
V
I(avg)
x I
(Q)
A
B
C
TJ
A
RθJC
TC
B
RθCS
TA
C
RθSA
(a)
(b)
DDPAK Package
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
TPS78601, TPS78618
TPS78625, TPS78628
TPS78630, TPS78633
SLVS389D – SEPTEMBER 2002 – REVISED OCTOBER 2004
THERMAL INFORMATION
temperature due to the regulator's power dissipation.
The amount of heat that an LDO linear regulator
The temperature rise is computed by multiplying the
generates is directly proportional to the amount of
maximum expected power dissipation by the sum of
power it dissipates during operation. All integrated
the thermal resistances between the junction and the
circuits have a maximum allowable junction tempera-
case (RΘJC), the case to heatsink (RΘCS), and the
ture (TJMAX) above which normal operation is not
heatsink to ambient (RΘSA). Thermal resistances are
assured.
A
system
designer
must
design
the
measures of how effectively an object dissipates
operating environment so that the operating junction
heat. Typically, the larger the device, the more
temperature (TJ) does not exceed the maximum
surface area available for power dissipation and the
junction temperature (TJMAX). The two main environ-
lower the object's thermal resistance.
mental variables that a designer can use to improve
thermal performance are air flow and external
Figure 26 illustrates these thermal resistances for (a)
heatsinks. The purpose of this information is to aid
a SOT223 package mounted in a JEDEC low-K
the designer in determining the proper operating
board, and (b) a DDPAK package mounted on a
environment for a linear regulator that is operating at
JEDEC high-K board.
a specific power level.
Equation 5 summarizes the computation:
In general, the maximum expected power (PD(max))
consumed by a linear regulator is computed as
shown in Equation 4:
(5)
The RΘJC is specific to each regulator as determined
by its package, lead frame, and die size provided in
(4)
the regulator's data sheet. The RΘSA is a function of
where:
the type and size of heatsink. For example, black
body radiator type heatsinks can have RΘCS values
VI(avg) is the average input voltage.
ranging from 5
°C/W for very large heatsinks to
VO(avg) is the average output voltage.
50
°C/W for very small heatsinks. The RΘ
CS
is a
IO(avg) is the average output current.
function of how the package is attached to the
I(Q) is the quiescent current.
heatsink. For example, if a thermal compound is used
to attach a heatsink to a SOT223 package, RΘCS of
For most TI LDO regulators, the quiescent current is
1
°C/W is reasonable.
insignificant compared to the average output current;
therefore, the term VI(avg) x I(Q) can be neglected. The
operating junction temperature is computed by adding
the ambient temperature (TA) and the increase in
Figure 26. Thermal Resistances
11


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