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UCC29002, UCC29002-1, UCC39002

SLUS495I – SEPTEMBER 2001 – REVISED MAY 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage, current limited

−0.3

15

V

Supply voltage, voltage source

−0.3

13.5

V

Input voltage, current sense amplifier

–0.3

V

Current sense amplifier output voltage

−0.3

V

Load share bus voltage

−0.3

V

10

mA

Adjust pin input voltage

Adjust pin sink current

6

mA

Operating junction temperature range

−55

150

°C

Storage temperature

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2500

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, voltage source

4.575

13.5

V

Current sense amplifier output voltage

0

11.8

V

Load share bus voltage

0

V

Adjust pin sink current

4.55

mA

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

UCC2900x/UCC39002

UNIT

D (SOIC)

DGK (VSSOP)

P (PDIP)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

111.9

168.0

54.1

°C/W

Junction-to-case (top) thermal resistance

58.6

61.9

43.9

°C/W

Junction-to-board thermal resistance

52.6

88.8

31.2

°C/W

Junction-to-top characterization parameter

12.9

7.3

21.6

°C/W

Junction-to-board characterization parameter

52.0

87.2

31.1

°C/W

Junction-to-case (bottom) thermal resistance

—

—

—

°C/W