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MMSZ5237B Datasheet(PDF) 1 Page - Bruckewell Technology LTD |
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MMSZ5237B Datasheet(HTML) 1 Page - Bruckewell Technology LTD |
1 / 4 page MMSZ5221B-MMSZ5260B Surface mount zener diode Publication Order Number: [MMSZ5221B-MMSZ5260B] © Bruckewell Technology Corporation Rev. A -2014 Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATING @ Ta=25°C unless otherwise specified Symbol Parameter Value Unit VF Forward Voltage @ IF=10mA 0.9 V PD Power Dissipation 500 mW RθJA Thermal resistance,junction to ambient air 350 °C/W TJ Junction Temperature 150 °C Tstg Storage Temperature Range -65 to +150 °C Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp ≤1.0ms. |
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