MMSZ5221B-MMSZ5260B

Surface mount zener diode

Publication Order Number: [MMSZ5221B-MMSZ5260B]

Features

• Planar die construction.

• 500mW power dissipation.

• General purpose, medium current.

• Ideally suited for automated assembly processes.

• RoHS compliant package

Applications

• Zener diode.

• Ultra-small surface mount package.

Packing & Order Information

3,000/Reel

Graphic symbol

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

MAXIMUM RATING @ Ta=25°C unless otherwise specified

Symbol

Parameter

Value

Unit

VF

Forward Voltage @ IF=10mA

0.9

V

PD

Power Dissipation

500

mW

RθJA

Thermal resistance,junction to ambient air

350

°C/W

TJ

Junction Temperature

150

°C

Tstg

Storage Temperature Range

-65 to +150

°C

Notes:

1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.

2. Tested with pulses, Tp ≤1.0ms.