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TPA005D02DCA Datasheet(PDF) 5 Page - Texas Instruments |
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TPA005D02DCA Datasheet(HTML) 5 Page - Texas Instruments |
5 / 25 page TPA005D02 2-W STEREO CLASS-D AUDIO POWER AMPLIFIER SLOS227C – AUGUST 1998 – REVISED MARCH 2000 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN NOM MAX UNIT Supply voltage, PVDD, LPVDD, RPVDD, VDD 4.5 5.5 V High-level input voltage, VIH 4.25 V Low-level input voltage, VIL 0.75 V Audio inputs, LINN, LINP, RINN, RINP, HPLIN, HPRIN, differential input voltage 1 VRMS PWM frequency 100 500 kHZ electrical characteristics, VDD = PVDD = LPVDD = RPVDD = 5 V, RL = 4 Ω, TC = 25°C, See Figure 1 (resistive load) (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PSRR Power supply rejection ratio VDD = PVDD = LPVDD = RPVDD = 4.9 V to 5.1 V 40 dB IDD Supply current No load or output filter 25 40 mA IDD(MUTE) Supply current, mute mode MUTE = 0 V 10 15 mA IDD(SD) Supply current, shutdown mode SHUTDOWN = 0 V 400 2000 µA IIH High-level input current VIH = 5.3 V 10 µA IIL Low-level input current VIL = – 0.3 V –10 µA rDS(on) Total static drain-to-source on-state resistance (low-side plus high-side FETs) ID = 0.5 A 620 750 m Ω rDS(on) Matching 95% 99.5% operating characteristics, VDD = PVDD = LPVDD = RPVDD = 5 V, RL = 4 Ω, TC = 25°C, See Figure 1 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PO RMS output power, THD = 0.5%, per channel 2 W THD+N Total harmonic distortion plus noise PO = 1 W, f = 1 kHz 0.2% Efficiency RL = 8 Ω 80% AV Gain 24 dB Left/right channel gain matching 95% Noise floor 60 dB Dynamic range 70 dB Crosstalk f = 1 kHz 55 dB Frequency response bandwidth, post output filter, – 3 dB 20 20,000 Hz BOM Maximum output power bandwidth 20 kHz thermal resistance PARAMETER TEST CONDITIONS MIN TYP MAX UNIT R θJP Thermal resistance, junction-to-pad 10 °C/W R θJA Thermal resistance, junction-to-pad† 22.3 °C/W † Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document. |
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