Dual Full Bridge Motor Driver

A3909

9

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Package LY, 10-Pin MSOP

With Exposed Thermal Pad

Terminal #1 mark area

A

Gauge Plane

Seating Plane

0.86 ±0.05

SEATING

PLANE

0.50

REF

0.25

2

1

10

2

1

10

A

B

C

C

0.53 ±0.10

0.15 ±0.05

0.05

0.15

0° to 6°

3.00 ±0.10

3.00 ±0.10

4.88 ±0.20

1.73

4.60

1.98

1.98 MIN

1.73

2

1

10

1

0.30

0.50

1.65

0.27

0.18

For Reference Only; not for tooling use (reference JEDEC MO-187BA-T)

Dimensions in millimeters

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

B

Exposed thermal pad (bottom surface)

Reference land pattern layout (reference IPC7351 SOP50P490X110-11M)

All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances; when

mounting on a multilayer PCB, thermal vias at the exposed thermal pad land

can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)