4

INA300

SBOS613B – FEBRUARY 2014 – REVISED APRIL 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Input voltage may exceed the voltage shown if the current at that terminal is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

6

V

Analog inputs (IN+, IN–)

(2)

–40

40

V

GND – 0.3

40

Analog input

LIMIT

GND – 0.3

V

Digital inputs

LATCH, DELAY, ENABLE, HYS

GND – 0.3

V

Alert output

GND – 0.3

6

V

Operating temperature

–40

125

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

12

V

Operating supply voltage

2.7

3.3

5.5

V

Delay setting

100

µs

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

INA300

UNIT

DSQ (WSON)

DGS (VSSOP)

10 PINS

10 PINS

Junction-to-ambient thermal resistance

63.5

169.4

°C/W

Junction-to-case (top) thermal resistance

79.5

59.1

°C/W

Junction-to-board thermal resistance

33.9

89.6

°C/W

Junction-to-top characterization parameter

7.8

8.5

°C/W

Junction-to-board characterization parameter

34.3

88.3

°C/W

Junction-to-case (bottom) thermal resistance

7.5

n/a

°C/W