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TPS22914C Datasheet(PDF) 4 Page - Texas Instruments |
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TPS22914C Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page TPS22914B, TPS22914C, TPS22915B, TPS22915C SLVSCO0C – JUNE 2014 – REVISED JULY 2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN Input voltage range –0.3 6 V VOUT Output voltage range –0.3 6 V VON ON voltage range –0.3 6 V IMAX Maximum continuous switch current 2 A IPLS Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle 2.5 A TJ Maximum junction temperature 125 °C TSTG Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 8.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 8.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage range 1.05 5.5 V VON ON voltage range 0 5.5 V VOUT Output voltage range VIN V VIH, ON High-level input voltage, ON VIN = 1.05 V to 5.5 V 1 5.5 V VIL, ON Low-level input voltage, ON VIN = 1.05 V to 5.5 V 0 0.5 V TA Operating free-air temperature range(1) –40 105 °C CIN Input Capacitor 1(2) µF (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(MAX)], the maximum power dissipation of the device in the application [PD(MAX)], and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA(MAX) = TJ(MAX) – (θJA × PD(MAX)). (2) Refer to Detailed Description section 8.4 Thermal Information TPS2291x THERMAL METRIC(1) YFP (DSBGA) UNIT 4 PINS RθJA Junction-to-ambient thermal resistance 193 °C/W RθJC(top) Junction-to-case (top) thermal resistance 2.3 °C/W RθJB Junction-to-board thermal resistance 36 °C/W ψJT Junction-to-top characterization parameter 12 °C/W ψJB Junction-to-board characterization parameter 36 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: TPS22914B TPS22914C TPS22915B TPS22915C |
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