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TPS22918 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS22918 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page 4 TPS22918-Q1 SLVSCZ8A – JULY 2016 – REVISED JULY 2016 www.ti.com Product Folder Links: TPS22918-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) Assumes 12-K power-on hours at 100% duty cycle. This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI's semiconductor products. 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 6 V VON ON voltage –0.3 6 V IMAX Maximum continuous switch current, TA = 70°C (3) 2 A IMAX Maximum continuous switch current, TA = 85°C (3) 1.5 A IPLS Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle 2.5 A TJ Maximum junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±750 (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(MAX)], the maximum power dissipation of the device in the application [PD(MAX)], and the junction-to-ambient thermal resistance of the part-package in the application (θJA), as given by the following equation: TA(MAX) = TJ(MAX) – (θJA × PD(MAX)). (2) See the Application and Implementation section. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage 1 5.5 V VON ON voltage 0 5.5 V VOUT Output voltage VIN V VIH, ON High-level input voltage, ON VIN = 1 V to 5.5 V 1 5.5 V VIL, ON Low-level input voltage, ON VIN = 1 V to 5.5 V 0 0.5 V TA Operating free-air temperature (1) –40 105 °C CIN Input Capacitor 1 (2) µF (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC (1) TPS22918-Q1 UNIT DBV (SOT-23) 6 PINS RθJA Junction-to-ambient thermal resistance 183.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 151.6 °C/W RθJB Junction-to-board thermal resistance 34.1 °C/W ψJT Junction-to-top characterization parameter 37.2 °C/W ψJB Junction-to-board characterization parameter 33.6 °C/W |
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