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TPS22918-Q1

SLVSCZ8A – JULY 2016 – REVISED JULY 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

Assumes 12-K power-on hours at 100% duty cycle. This information is provided solely for your convenience and does not extend or

modify the warranty provided under TI's standard terms and conditions for TI's semiconductor products.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

–0.3

6

V

ON voltage

–0.3

6

V

(3)

2

A

(3)

1.5

A

Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle

2.5

A

Maximum junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

(2)

See the Application and Implementation section.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

1

5.5

V

ON voltage

0

5.5

V

Output voltage

V

High-level input voltage, ON

1

5.5

V

Low-level input voltage, ON

0

0.5

V

–40

105

°C

Input Capacitor

µF

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TPS22918-Q1

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

183.2

°C/W

Junction-to-case (top) thermal resistance

151.6

°C/W

Junction-to-board thermal resistance

34.1

°C/W

Junction-to-top characterization parameter

37.2

°C/W

Junction-to-board characterization parameter

33.6

°C/W