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TPS22915 Datasheet(PDF) 1 Page - Texas Instruments |
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TPS22915 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 26 page VIN (V) 1.05 1.55 2.05 2.55 3.05 3.55 4.05 4.55 5.05 5.5 20 30 40 50 60 70 80 D005 -40°C 25°C 85°C 105°C Power Supply OFF ON TPS22914/15 VIN VOUT RL CL GND ON GND CIN Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPS22914B, TPS22914C, TPS22915B, TPS22915C SLVSCO0C – JUNE 2014 – REVISED JULY 2015 TPS2291xx, 5.5-V, 2-A, 37m Ω On-Resistance Load Switch 1 Features 3 Description The TPS22914/15 is a small, low RON, single channel 1 • Integrated Single Channel Load Switch load switch with controlled slew rate. The device • Input Voltage Range: 1.05 V to 5.5 V contains an N-channel MOSFET that can operate • Low On-Resistance (RON) over an input voltage range of 1.05 V to 5.5 V and can support a maximum continuous current of 2 A. – RON = 37 mΩ (Typ) at VIN = 5 V The switch is controlled by an on/off input, which is – RON = 38 mΩ (Typ) at VIN = 3.3 V capable of interfacing directly with low-voltage control – RON = 43 mΩ (Typ) at VIN = 1.8 V signals. • 2-A Maximum Continuous Switch Current The small size and low RON makes the device ideal • Low Quiescent Current for being used in space constrained, battery powered applications. The wide input voltage range of the – 7.7 µA (typ) at VIN = 3.3 V switch makes it a versatile solution for many different • Low Control Input Threshold Enables Use of 1.0-V voltage rails. The controlled rise time of the device or Higher GPIO greatly reduces inrush current caused by large bulk • Controlled Slew Rate load capacitances, thereby reducing or eliminating power supply droop. The TPS22915 further reduces – tR(TPS22914B/15B) = 64 µs at VIN = 3.3 V the total solution size by integrating a 143- Ω pull- – tR(TPS22914C/15C) = 913 µs at VIN = 3.3 V down resistor for quick output discharge (QOD) when • Quick Output Discharge (TPS22915 only) the switch is turned off. • Ultra-Small Wafer-Chip-Scale Package The TPS22914/15 is available in a small, space- – 0.78 mm × 0.78 mm, 0.4-mm Pitch, saving 0.78 mm x 0.78 mm, 0.4-mm pitch, 0.5-mm 0.5-mm Height (YFP) height 4-pin Wafer-Chip-Scale (WCSP) package (YFP). The device is characterized for operation over • ESD Performance Tested per JESD 22 the free-air temperature range of –40°C to 105°C. – 2-kV HBM and 1-kV CDM Device Information(1) 2 Applications PART NUMBER PACKAGE BODY SIZE (NOM) • Smartphones / Mobile Phones TPS22914B • Ultrathin / Ultrabook™ / Notebook PC TPS22914C DSBGA (4) 0.78 mm x 0.78 mm • Tablet PC / Phablet TPS22915B • Wearable Technology TPS22915C • Solid State Drives (1) For all available packages, see the orderable addendum at the end of the datasheet. • Digital Cameras RON vs VIN (IOUT = –200 mA) 4 Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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