5

TPS22965

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SLVSBJ0F – AUGUST 2012 – REVISED AUGUST 2016

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Copyright © 2012–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

–0.3

6

V

Bias voltage

–0.3

6

V

On voltage

–0.3

6

V

Maximum continuous switch current

6

A

Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle

8

A

Maximum junction temperature

125

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

(1)

See the Application Information section.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input voltage

0.8

V

Bias voltage

2.5

5.7

V

ON voltage

0

5.7

V

Output voltage

V

High-level input voltage, ON

1.1

5.7

V

Low-level input voltage, ON

0

0.5

V

Input capacitor

µF

–40

105

°C