5

TPS22990

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SLVSDK1A – MAY 2016 – REVISED JULY 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS22990

UNIT

DML (WSON)

10 PINS

Junction-to-ambient thermal resistance

51.4

°C/W

Junction-to-case (top) thermal resistance

65

°C/W

Junction-to-board thermal resistance

17

°C/W

Junction-to-top characterization parameter

2.1

°C/W

Junction-to-board characterization parameter

17

°C/W

Junction-to-case (bottom) thermal resistance

3.7

°C/W

Unless otherwise noted, the specification in the following table applies over the operating ambient temp –40°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLIES AND CURRENTS

–40°C to +85°C

63

76

µA

–40°C to +105°C

77

–40°C to +85°C

5.5

7

µA

–40°C to +105°C

7

–40°C to +85°C

0.004

4

µA

–40°C to +105°C

10

–40°C to +85°C

0.003

3

–40°C to +105°C

7

–40°C to +85°C

0.002

2

–40°C to +105°C

5

–40°C to +85°C

0.002

2

–40°C to +105°C

4

–40°C to +85°C

0.001

1

–40°C to +105°C

3

–40°C to +85°C

0.001

1

–40°C to +105°C

2

ON pin input leakage

current

–40°C to +105°C

0.1

µA

ON pin hysteresis

25°C

123

mV

–40°C to +105°C

0.5

µA

PG output low voltage

–40°C to +105°C

0.2

V

RESISTANCE CHARACTERISTICS