OPA322, OPA322S

OPA2322, OPA2322S

OPA4322, OPA4322S

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SBOS538E – JANUARY 2011 – REVISED JUNE 2012

THERMAL INFORMATION: OPA322

OPA322

OPA322S

DBV

DBV

UNITS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

219.3

177.5

Junction-to-case(top) thermal resistance

107.5

108.9

Junction-to-board thermal resistance

57.5

27.4

°C/W

Junction-to-top characterization parameter

7.4

13.3

Junction-to-board characterization parameter

56.9

26.9

Junction-to-case(bottom) thermal resistance

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2322

OPA2322

OPA2322S

D

DRG

DGK

DGS

8 PINS

8 PINS

8 PINS

10 PINS

UNITS

Junction-to-ambient thermal resistance

122.6

50.6

174.8

171.5

Junction-to-case(top) thermal resistance

67.1

54.9

43.9

43.0

Junction-to-board thermal resistance

64.0

25.2

95.0

91.4

°C/W

Junction-to-top characterization parameter

13.2

0.6

2.0

1.9

Junction-to-board characterization parameter

63.4

25.3

93.5

89.9

Junction-to-case(bottom) thermal resistance

n/a

5.7

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4322

OPA4322

OPA4322S

PW

PW

14 PINS

16 PINS

UNITS

Junction-to-ambient thermal resistance

109.8

105.9

Junction-to-case(top) thermal resistance

34.9

28.1

Junction-to-board thermal resistance

52.5

51.1

°C/W

Junction-to-top characterization parameter

2.2

0.8

Junction-to-board characterization parameter

51.8

50.4

Junction-to-case(bottom) thermal resistance

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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Product Folder Link(s): OPA322 OPA322S OPA2322 OPA2322S OPA4322 OPA4322S