OPA551, OPA552

SBOS100B – JULY 1999 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

60

V

(V–) – 0.5

(V+) + 0.5

V

Output

See SOA Curve (Safe Operating Area)

–55

125

°C

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

8 (±4)

60 (±30)

V

Specified temperature

–40

125

°C

6.4 Thermal Information

OPA551, OPA552

D

P

KTW

UNIT

(SOIC)

(PDIP)

(DDPAK/TO-263)

8 PINS

8 PINS

7 PINS

Junction-to-ambient thermal resistance

96.7

44.1

22.7

°C/W

38.7

31.8

34.7

°C/W

Junction-to-board thermal resistance

38.2

21.4

7.7

°C/W

Junction-to-top characterization parameter

3.7

9.1

3.3

°C/W

Junction-to-board characterization parameter

37.5

21.2

7.7

°C/W

—

—

0.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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